SOI Wafers

Thick Film Fusion Bonding

All Diameters:

• 3” through 200 mm:
• Single- or Double Side Polished
• CZ and FZ

Device Layer: Flatness <1 µm <2 µm <5 µm

Buried Thermal Oxide: 0,2µm to 2,4µm

Handle:

• Flatness <1µm up
• Any Typ, Orientation, Res.

Thickness: 300µm to 2000µm