Prime, Monitor, Test, CZ and FZ, all diameters, single- or doubleside polished, as cut, lapped, etched, ...
Silicon on Insulator, thick film, bonding, 3” through 200mm, single- or doubleside polished CZ and FZ, buried thermal oxide, ...
Wafer thinning, reduction of wafer size, lasermarking, edge grinding, lapping, thin films, oxides, ...
Wafers for integrated circuit manufacturing
MEMS microelectromechanical systems
EPI wafers for sensor and semiconductors manufacturing
SOI wafers for advanced sensor technology