Special Services

  • Wafer Thinning
  • Wafer Grinding – Thinner and Smaler – Ultra Thin
  • Wafer size reduction
  • Wafer (Kiru) Blade dicing
  • Wafer Laser dicing
  • Laser Marking
  • Edge Grinding
  • Lapping
  • Wafer Reclaim

Do you have another question or specification? Let us know. We take care of it.

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